custom 1000w bonded fin cooler 2u server Vc vapor chamber cpu gpu heatsink heat sink for Artificial Intelligence Servers

Overview of Heatlinks

Heatlinks function by providing a path of low thermal resistance between a heat source (such as an electronic component) and a heat sink or cooling system. They can be particularly useful in environments where space constraints limit the use of traditional cooling methods, or when a passive thermal management solution is preferred.

Heatlinks can operate based on different principles, including phase change materials, solid-state conduction, or even fluid-based systems. The choice of technology depends on the application’s specific requirements, such as operating temperature range, power dissipation levels, and spatial limitations.

Features of Heatlinks

High Thermal Conductivity: Designed to offer high thermal conductivity, ensuring efficient heat transfer from the source to the sink.

Compact Design: Often compact, allowing them to fit into tight spaces within electronic assemblies or other equipment.

Passive Operation: Typically do not require external power to function, relying instead on the natural flow of heat from hot to cold areas.

Durability and Reliability: Manufactured to withstand repeated thermal cycles and harsh environmental conditions without degradation of performance.

Low Profile: Thin profiles help minimize the impact on the overall design of products.

Versatility: Can be tailored to fit various applications, from consumer electronics to industrial machinery and aerospace components.

Customizable: Available in different shapes, sizes, and configurations to meet specific design needs.

Cost-Effective: Provide an economical solution for thermal management compared to more complex cooling systems.

Minimal Maintenance: Generally require little to no maintenance once installed.

Environmental Compatibility: Designed to be compatible with a wide range of environments, including those that may contain corrosive elements or experience significant temperature fluctuations.

(custom 1000w bonded fin cooler 2u server Vc vapor chamber cpu gpu heatsink heat sink for Artificial Intelligence Servers)

Specifications of custom 1000w bonded fin cooler 2u server Vc vapor chamber cpu gpu heatsink heat sink for Artificial Intelligence Servers

This custom 1000W bonded fin cooler is built for high-performance artificial intelligence servers. The 2U server design fits standard rack systems. The VC vapor chamber technology spreads heat fast. It works for CPU and GPU cooling. The bonded fin structure increases surface area. This improves heat dissipation. The base material is copper. It ensures strong thermal conductivity. Aluminum fins reduce weight. They keep the cooler lightweight but durable. The maximum thermal capacity reaches 1000W. This handles intense workloads from AI computations.

The cooler uses a vapor chamber for even heat distribution. Hotspots are minimized. This stabilizes temperatures during long tasks. The fins are tightly packed. They are bonded using advanced welding. This prevents loosening under vibration. The design supports continuous operation. It avoids performance drops from overheating.

Compatibility covers major server CPUs and GPUs. Mounting hardware is included. Installation is simple. No extra tools are needed. The height stays within 2U limits. It saves space in server racks. The fanless design cuts noise. This suits data centers needing quiet environments.

Thermal interface materials are pre-applied. They ensure full contact with chips. Airflow resistance is low. This works with existing server cooling systems. Maintenance is minimal. Dust resistance extends lifespan. Testing includes stress simulations. It passes 72-hour stability checks.

Materials are corrosion-resistant. They handle humid or harsh conditions. The surface is anodized. This adds protection against wear. Customization is available. Sizes and mounting options can adjust. Bulk orders ship with protective packaging. Each unit undergoes quality inspection.

Applications include AI training servers, cloud computing nodes, and edge computing setups. The cooler suits environments demanding reliability. It prevents throttling in high-load scenarios. Energy efficiency reduces power costs. The design meets industry safety standards. Thermal performance is verified in lab tests. Data sheets provide detailed metrics. Support includes a 3-year warranty. Technical assistance is offered for integration.

(custom 1000w bonded fin cooler 2u server Vc vapor chamber cpu gpu heatsink heat sink for Artificial Intelligence Servers)

Applications of custom 1000w bonded fin cooler 2u server Vc vapor chamber cpu gpu heatsink heat sink for Artificial Intelligence Servers

The custom 1000W bonded fin cooler 2U server VC vapor chamber CPU GPU heatsink is designed for high-performance artificial intelligence servers. AI servers handle complex tasks like machine learning and data processing. These tasks generate intense heat. Traditional cooling methods struggle to manage this heat. The bonded fin cooler solves this problem. It combines vapor chamber technology with bonded fin design. This setup improves heat transfer efficiency. The vapor chamber spreads heat evenly. The bonded fins increase surface area for faster cooling. The result is stable operation under heavy workloads.

AI servers in data centers benefit from this heatsink. Data centers run non-stop. Overheating can cause downtime. The 1000W cooling capacity ensures continuous operation. Server racks often use compact 2U configurations. Space is limited. The heatsink’s slim design fits tightly. It maximizes airflow without sacrificing performance. This is critical for AI clusters. Multiple servers work together in these clusters. Consistent cooling prevents thermal throttling. Processing speeds stay high.

Machine learning models require powerful GPUs. GPUs produce more heat than CPUs. The heatsink handles both. Its vapor chamber covers large areas. Hotspots are reduced. Training AI models takes days or weeks. Reliable cooling avoids interruptions. Edge computing servers also use this solution. Edge devices operate in harsh environments. Dust or vibration can damage components. The bonded fin structure resists wear. Maintenance needs drop. Energy efficiency matters for AI infrastructure. The heatsink lowers fan speeds. Power consumption decreases. Noise levels drop too.

Cloud service providers rely on efficient cooling. Server density keeps rising. Heat output grows. The 1000W capacity supports next-gen AI hardware. High-power CPUs and GPUs work safely. Customization options let users adapt the heatsink. Specific server layouts or thermal profiles are accommodated. AI applications expand into healthcare and robotics. These fields demand precision. Stable thermal management ensures accuracy. The bonded fin cooler meets these demands. It extends hardware lifespan. Server reliability improves. Downtime costs shrink.

Company Profile

PDDN Photoelectron Technology Co., Ltd.(sales@pddn.com) is one of the leading enterprises in power electronics technology and power products, which is fully involved in developing solar inverters， transformers, voltage regulators, distribution cabinets, thyristors， modules， diodes， heaters, and other electronic devices or semiconductors. We will be committed to providing users with high-quality, efficient products and considerate service.

It accepts payment via Credit Card, T/T, West Union, and Paypal. PDDN will ship the goods to customers overseas through FedEx, DHL, by sea, or by air. If you want high-quality custom 1000w bonded fin cooler 2u server Vc vapor chamber cpu gpu heatsink heat sink for Artificial Intelligence Servers, please send us inquiries; we will be here to help you.

Payment Methods

L/C, T/T, Western Union, Paypal, Credit Card etc.

Shipment

By sea, by air, by express, as customers request.

Storage Conditions

1) Store in a dry environment at room temperature.

2) Avoid damp and high temperature.

3) Use immediately after opening the inner packing bag.

5 FAQs of custom 1000w bonded fin cooler 2u server Vc vapor chamber cpu gpu heatsink heat sink for Artificial Intelligence Servers

What is the main purpose of the custom 1000W bonded fin cooler 2U server VC vapor chamber CPU GPU heatsink?
This heatsink removes heat from high-performance CPUs and GPUs in AI servers. AI servers run complex tasks. These tasks create lots of heat. The bonded fin design and vapor chamber spread heat fast. This keeps components cool. Stable temperatures prevent slowdowns or damage.

Is this heatsink compatible with all AI server models?
The heatsink fits most 2U server chassis. It works with major brands like Dell, HPE, and Supermicro. Check your server’s CPU and GPU socket types first. Custom mounts or sizing can be requested. Contact support for specific compatibility details.

Why does this cooler have a 1000W thermal design power (TDP)?
AI servers need strong cooling. High TDP means it handles extreme heat from processors. The bonded fins increase surface area. The vapor chamber moves heat evenly. This combo manages up to 1000W. It ensures reliability during heavy AI workloads like training or inference.

How hard is installation?
Installation uses standard tools. Follow the included guide. Align the heatsink with the CPU or GPU. Secure it with screws. Thermal paste is pre-applied. No extra steps needed. Servers stay operational longer with minimal downtime.

What makes this cooler better than traditional heatsinks?
Bonded fins boost airflow efficiency. Traditional fins are less dense. The vapor chamber moves heat faster than heat pipes. The 2U size saves space without losing power. This design cuts temperatures by 15-20% compared to basic coolers. AI servers run smoother and last longer.

(custom 1000w bonded fin cooler 2u server Vc vapor chamber cpu gpu heatsink heat sink for Artificial Intelligence Servers)